| Item | IBM Power6 | Sun UltraSparc V | Fujitsu SPARC64 VI | Power5+ | Sun Gemini | IBM Power5 | Sun UltraSparc IV | PowerPC 970 |
|---|---|---|---|---|---|---|---|---|
| Release | 2007 | 2006 | 2006-H2 | 2005-10-04 | 2004 | 2004-06-11 | 2004-02-10 | 2003-06-23 |
| Die size | 19.1 x 20.3 mm | 206 mm2 | 4 x 389 mm2 + L3 cache | 356 mm2 | 121 (267) mm2 | |||
| Bus speed | GX+I/O >6GB/s | Fireplane 150 MHz | 1000 MHz, 6.4 GB/s | |||||
| L2 cache | 6-12 MB | 6 MB | 2 x 512 KB | 4 x 3 x 640 KB | 16 MB off die | 512 KB 8-way SA | ||
| L1 cache | D:64 KB | 128 KB I, 128 KB D | 4 x 64KB I; 32KB D | D:64 KB, I:32 KB | I:64 KB, D:32 KB 2-way SA | |||
| Process | 65 nm SOI | 90 nm | 90 nm, Cu, 10 layer | 90 nm | 130 nm | 130 nm CuSOI | 130 nm | 130 nm SOI |
| Core speed | 4 - 4.5 GHz | 1.8 - 3.0 GHz | >2.4 GHz | 1.9 GHz | 1.2 GHz | 1.4 - 2 GHz | 1.2 GHz | 1.8 GHz |
| Transistors | 750 M | 690 M | 80 M | 4 x 276 M + L3 cache | 66 M | 58 M+ | ||
| Power | 32 W | 108 W | 42 W @ 1.8 GHz | |||||
| Form factor | 360 pin | 5400 pin | LGA1368 | 576-CBGA | ||||
| Core voltage | 0.9 - 1.2V | 1.0 / 1.8 V | 1.35 V | 1.3 V | ||||
| Price | ||||||||
| L3 cache | 4 x 36 MB (off-die, on MCM) | |||||||
| Memory | 128 bit 133 MHz DDR | DDR / DDR-2 | 16 GB, 2.4 GB/s | |||||
| Type | Server | Server | Server, 2 cores | Server, 4 x 2 cores | Server, 2 cores | Server | ||
| Core | Olympus | Gemini | Power5 | Jaguar | Power4 | |||
| Pipeline | 2-stage | 14-stage | 23 stage | |||||
| Platform | ||||||||
2007 IBM Power6 Successor to Power5+, due out in 2006 or 2007, boasting "very large frequency enhancements"... Expected to use a 65 nm process.
2006 Sun UltraSparc V Runs at more than 1.8 to above 3 GHz and is built using a 90 nm process. Five times faster than UltraSPARC III. Previously planned for 2005.
2006-H2 Fujitsu SPARC64 VI Dual core version of SPARC64 V built in a 90 nm process. Said to show in late 2005 or early 2006.
2005-10-04 Power5+ Quad-core, and multi-threaded successor to Power5 built in a 90 nm process and running at up to 1.9 GHz.
2004 Sun Gemini Sun Blade processor based on two UltraSparc II chips built on a 130 nm process
2004-06-11 IBM Power5
Successor to Power4 built in 0.13 um technology. The MCM (Multi Chip Module) includes 4 chips with two MultiThreaded cores each presenting a total of 16 virtual cores on the MCM. Each chip also has a 36 MB L3 cache attached for a total of 144 MB of L3 cache on the MCM. Each MCM can be connected to other MCMs through a 4GB/s bus for up to 128-way multiprocessing.
A single core version, also with Simultaneous MultiThreading, may also be launched. Each core includes 120 registers (80 on the Power4) and is said to have 40% to 100% better performance. Will later move to 90 nm with the Power5+ version.
Will be available 2004-06-11.
2004-02-10 Sun UltraSparc IV 4-way superscalar processor built with a 130 nm process running at 1.2 to 2 GHz. Consists of 2 UltraSPARC III pipelines. Pin compatible with UltraSPARC III. Previously code named Jaguar and planned for 03-H2. Later made in a 90 nm version.
2003-06-23 PowerPC 970 Single core version of the Power4 architecture also known as Power4+. Debuts at 1.4 - 1.8 GHz with a 900 MHz bus and more than 58 million transistors. It is built in a 0.13 um SoI / copper process. Bus bandwith 6.4 GB/s.