2003-06-23 PowerPC 970 Single core version of the Power4 architecture also known as Power4+. Debuts at 1.4 - 1.8 GHz with a 900 MHz bus and more than 58 million transistors. It is built in a 0.13 um SoI / copper process. Bus bandwith 6.4 GB/s.
2004-02-10 Sun UltraSparc IV 4-way superscalar processor built with a 130 nm process running at 1.2 to 2 GHz. Consists of 2 UltraSPARC III pipelines. Pin compatible with UltraSPARC III. Previously code named Jaguar and planned for 03-H2. Later made in a 90 nm version.
2004-06-11 IBM Power5 Successor to Power4 built in 0.13 um technology. The MCM (Multi Chip Module) includes 4 chips with two MultiThreaded cores each presenting a total of 16 virtual cores on the MCM. Each chip also has a 36 MB L3 cache attached for a total of 144 MB of L3 cache on the MCM. Each MCM can be connected to other MCMs through a 4GB/s bus for up to 128-way multiprocessing.
A single core version, also with Simultaneous MultiThreading, may also be launched. Each core includes 120 registers (80 on the Power4) and is said to have 40% to 100% better performance. Will later move to 90 nm with the Power5+ version.
Will be available 2004-06-11.
2004 Sun Gemini Sun Blade processor based on two UltraSparc II chips built on a 130 nm process
2006 Sun UltraSparc V Runs at more than 1.8 to above 3 GHz and is built using a 90 nm process. Five times faster than UltraSPARC III. Previously planned for 2005.